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W988D6FBGX6E Quick Quote & Ship


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W988D6FBGX6E Datasheet
W988D6FBGX6E(WINBOND) Specifications
Manufacturer: Winbond Electronics
Product Category: Memory
Series: -
Packaging: Tray Alternate Packaging
Package-Case: 54-TFBGA
Operating-Temperature: -25°C ~ 85°C (TC)
Interface: Parallel
Voltage-Supply: 1.7 V ~ 1.95 V
Supplier-Device-Package: 54-VFBGA (8x9)
Memory-Size: 256M (16M x 16)
Memory-Type: Mobile LPSDR SDRAM
Speed: 166MHz
Format-Memory: RAM

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